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The Vertical Revolution: Scaling Up Performance with 3D Semiconductor Packaging
In the fierce race for digital supremacy, the traditional method of making chips smaller—known as Moore’s Law scaling—is running into physical limits. The industry’s solution? Building up, not just shrinking down. The 3D Semiconductor Packaging Market is the battleground where the next generation of computing power is being forged, driving a fundamental shift in how chips are designed, manufactured, and utilized in almost every electronic device.
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